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行业品名相互参照

产品参数

  • S8AC-S8MC
  • Features

    • Low profile package
    • For surface mounted applications
    • High current capability
    • Built-in strain relief, ideal for automated placement
    • Plastic package has Underwriters Laboratory Flammability Classification 94V-0
    • High temperature soldering: 250℃/10 seconds at terminals

    Mechanical data

    • Case: JEDEC DO-214AB,molded plastic over passivated chip
    • Terminals: Solder Plated, solderable per MIL-STD- 750, Method 2026
    • Polarity: Color band denotes cathode end

    产品属性

    VRRM(V):50 to 1000
    I(AV)(A):8.0
    IFSM(A):200
    VF(V):1.15
    IR(uA):10
    trr(uS):-