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封装产品
行业品名相互参照
产品参数
Features
- Glass passivated chip junction
- 600W surge capacity @ 10/1000 μSec wave form
- Fast response, typically less then 1 pSec
- Low Zener impedence
- Excellent clamping capability
- Available in either “J” lead (P6SMB) of “G” lead (SMBG)
- High temperature soldering guaranteed: 250OC/ seconds at terminals
Mechanical data
• Case: transfer molded plastic
• Epoxy: UL94V – 0 rate flame retardant
• Polarity: Color band denotes cathode end, except on bipolar parts which have no band
• Terminals: solderable per MIL-STD-202E method 208C
• Weight: 0.003 ounce, 0.093 gram
产品属性
VRRM(V)：
I(AV)(A)：
IFSM(A)：
VF(V)：
IR(uA)：
trr(uS)：