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DSK12-DSK110

• Low profile package
• Ideal for automated placement
• Ultrafast reverse recovery time
• Low power losses, high efficiency
• Low forward voltage drop
• High surge capability
• High temperature soldering：260℃/10 seconds at terminals
• Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

• Case: JEDEC SOD-123FL molded plastic body over passivated chip
• Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
• Polarity: Laser band denotes cathode end
• Weight: 0.017gram

VRRM(V)：20 to 100
I(AV)(A)：1.0
IFSM(A)：25
VF(V)：0.5 to 0.85
IR(uA)：1000
trr(uS)：-