产品名称
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封装产品
行业品名相互参照
产品参数
Features
- Surface mounted devices
- Low forward voltage drop
- Low forward leakage
- High forward surge current capability
- High temperature soldering guaranteed: 260℃/10 seconds at 5lbs. (2.3kg) tension.
- RoHS and REACH Compliance
Mechanical data
- Case: Molded plastic body
- Polarity: Polarity symbols marked on case
- Terminals: Leads solderable per MIL-STD-202E method 208C
- Mounting position: Any
- Weight: 0.002 ounce 0.064 gram
产品属性
VRRM(V):50 to 1000
I(AV)(A):1.0
IFSM(A):30
VF(V):1.1
IR(uA):5.0
trr(uS):-