 产品名称
产品名称
                
                	 关键字搜索
关键字搜索
                
                	 封装产品
封装产品
                
                	 行业品名相互参照
行业品名相互参照
                
            	产品参数
            
            
            
            
            
            
            	Features
            
            
- Surface mounted devices
- Low forward voltage drop
- Low forward leakage
- High forward surge current capability
- High temperature soldering guaranteed: 260℃/10 seconds at 5lbs. (2.3kg) tension.
- RoHS and REACH Compliance
            	Mechanical data 
            
            
- Case: Molded plastic body
- Polarity: Polarity symbols marked on case
- Terminals: Leads solderable per MIL-STD-202E method 208C
- Mounting position: Any
- Weight: 0.002 ounce 0.064 gram
            	产品属性
            
            
            	VRRM(V):50 to 1000    
                I(AV)(A):1.0    
                IFSM(A):30    
                VF(V):1.1    
                IR(uA):5.0    
                trr(uS):-   
                
            

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