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产品参数
Features
- Low profile space
- Ideal for automated placement
- Glass passivated chip junctions
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- High temperature soldering:260℃/10 seconds at terminals
- Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical data
- Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
- Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
- Polarity: Laser band denotes cathode end
产品属性
VRRM(V):50 to 1000
I(AV)(A):1.0
IFSM(A):25
VF(V):1.1
IR(uA):5.0
trr(uS):-