产品中心

• 产品参数搜索

S8AC-S8MC

• Low profile package
• For surface mounted applications
• High current capability
• Built-in strain relief, ideal for automated placement
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• High temperature soldering: 250℃/10 seconds at terminals

• Case: JEDEC DO-214AB,molded plastic over passivated chip
• Terminals: Solder Plated, solderable per MIL-STD- 750, Method 2026
• Polarity: Color band denotes cathode end

VRRM(V)：50 to 1000
I(AV)(A)：8.0
IFSM(A)：200
VF(V)：1.15
IR(uA)：10
trr(uS)：-