产品名称
关键字搜索
封装产品
行业品名相互参照
产品参数
Features
- Low profile package
- For surface mounted applications
- High current capability
- Built-in strain relief, ideal for automated placement
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- High temperature soldering: 250℃/10 seconds at terminals
Mechanical data
- Case: JEDEC DO-214AB,molded plastic over passivated chip
- Terminals: Solder Plated, solderable per MIL-STD- 750, Method 2026
- Polarity: Color band denotes cathode end
产品属性
VRRM(V):50 to 1000
I(AV)(A):8.0
IFSM(A):200
VF(V):1.15
IR(uA):10
trr(uS):-