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封装产品
行业品名相互参照
产品参数
Features
- Glass passivated device
- Ideal for surface mounted applications
- Low leakage current
- Metallurgically bonded construction
- High temperature soldering: 250℃/10 seconds at terminals
Mechanical data
- Case: JEDEC SOD-123FL,molded plastic over passivated chip
- Terminals: Solder Plated, solderable perMIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Weight: 0.0008 ounces, 0.022 gram
- Mounting position: Any
产品属性
VRRM(V)：50 to 1000
I(AV)(A)：1.0
IFSM(A)：25
VF(V)：1.0 to 1.7
IR(uA)：10
trr(uS)：50ns to 70ns