产品名称
关键字搜索
封装产品
行业品名相互参照
产品参数
Features
- Glass passivated device
- Ideal for surface mounted applications
- Low leakage current
- Metallurgically bonded construction
- High temperature soldering: 250℃/10 seconds at terminals
Mechanical data
- Case: JEDEC SOD-123FL,molded plastic over passivated chip
- Terminals: Solder Plated, solderable perMIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Weight: 0.0008 ounces, 0.022 gram
- Mounting position: Any
产品属性
VRRM(V):50 to 1000
I(AV)(A):1.0
IFSM(A):25
VF(V):1.0 to 1.7
IR(uA):10
trr(uS):50ns to 70ns