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DSR1A-DSR1M

• Low profile space
• Ideal for automated placement
• Glass passivated chip junctions
• Low forward voltage drop
• Low leakage current
• High forward surge capability
• High temperature soldering：260℃/10 seconds at terminals
• Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

• Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
• Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
• Polarity: Laser band denotes cathode end

VRRM(V)：50 to 1000
I(AV)(A)：1.0
IFSM(A)：25
VF(V)：1.1
IR(uA)：5.0
trr(uS)：-