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SOD1H1-SOD1H8

• Glass passivated device
• Ideal for surface mounted applications
• Low leakage current
• Metallurgically bonded construction
• High temperature soldering: 250℃/10 seconds at terminals

• Case: JEDEC SOD-123FL,molded plastic over passivated chip
• Terminals: Solder Plated, solderable perMIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Weight: 0.0008 ounces, 0.022 gram
• Mounting position: Any

VRRM(V)：50 to 1000
I(AV)(A)：1.0
IFSM(A)：25
VF(V)：1.0 to 1.7
IR(uA)：10
trr(uS)：50ns to 70ns